出版日期：2025-10-21 00:00:00

著者：Yi‑Wun Wang; Kai‑Lin Cheng; Yu‑Ming Chen; Xiang‑Ting Lin; Jang‑Cheng Fang

著錄名稱、卷期、頁數：Journal of Materials Science: Materials in Electronics 36, p. 1904

摘要：As semiconductor technology advances, products are evolving toward higher performance and miniaturization. Moreover, global warming and climate change have considerably affected human life, making the development of low-temperature lead-free solder an important research topic. Sn3Ag0.5Cu solder balls were combined with low-temperature solder paste for energy efficiency. The process temperature was reduced by intermixing Sn3Ag0.5Cu solder balls and Sn52In solder paste. The mixed-assembly Sn3Ag0.5Cu/Sn52In solder joint was fabricated at a lower bonding temperature. This study presents an investigation of a composite solder system comprising medium–high-temperature lead-free solder Sn3Ag0.5Cu and a low-temperature lead-free solder Sn52In, which was bonded to an ENIG substrate. The microstructure and shear strength of the hybrid solder were examined. Sn52In low-temperature solder paste combined with Sn3Ag0.5Cu ball-grid-array (BGA) solder balls was used to reduce the process temperature. It enables the reflow process to occur at temperatures 155 ℃, compared to the typical 250 ℃ for standard SnAgCu solders. This reduction in temperature minimizes thermal stress on sensitive components and substrates, improving overall assembly reliability. The experimental results revealed that at 60 ℃, due to insufficient Cu content in the solder joint, heterogeneous nucleation resulted in discontinuous (Cu,Ni)6(Sn,In)5 in regions with relatively high Cu concentrations. At 80 ℃, the discontinuous (Cu,Ni)6(Sn,In)5 gradually transformed into a layered structure over time, and after 2000 h of aging, the reduction in the Cu content led to the transformation of (Cu,Ni)6(Sn,In)5 into (Ni,Cu)(Sn,In)2. At 130 ℃, after 1000 h of reaction, rapid intermetallic growth caused the surface treatment layer to fully react, resulting in failure. The ball shear test results revealed that the hybrid solder had a weak shear strength, with brittle fractures observed across all the tested samples. The shear stress decreased as a dual-layer intermetallic structure formed at the interface.

語言：en_US

期刊性質：國外

收錄於：SCI

審稿制度：是

國別：DEU

出版型式：電子版