出版日期：2006-06-01 00:00:00

著者：Lo, Shih-shou; Chen, Chii-chang; Hsu, Shih-chieh; Liu, Cheng-yi

單位：淡江大學化學工程與材料工程學系

出版者：Institute of Electrical and Electronics Engineers

著錄名稱、卷期、頁數：Journal of Microelectromechanical Systems 15(3), pp.584-587

摘要：This work demonstrates a direct amorphous Si low-temperature wafer bonding technique to fabricate a semiconductor hollow waveguide with omni-directional reflectors for use in near infrared applications. The 2% dilute KOH solution was used to bond two ODR Si wafers with an amorphous Si thin film on the top of Si wafers. The resultant bonding interface is very thin, with a thickness that is close to that of the SiO2 layer in the ODR substrate. Hence, the far-field image shows that light is strongly confined in the waveguides. The propagation loss was reduced to 1.0±0.5 db/cm in the TE and TM modes, broadening the development of the semiconductor hollow waveguide with omni-directional reflectors for use in optical communication applications.

語言：en

ISSN：1057-7157

期刊性質：國內

審稿制度：否

國別：TWN

出版型式：電子版