出版日期：2022-07-13 00:00:00

著者：Y. W. Wang; G. W. Wu; T. T. Tseng; H. T. Liang

著錄名稱、卷期、頁數：Journal of Materials Science: Materials in Electronics 33, p.18751-18757

摘要：Low-temperature solder is needed for temperature-sensitive components, step soldering and wearable devices. Low-temperature bonding is effective for reducing temperature and manufacturing costs. Indium has a low melting point, low resistance and good anticorrosion properties. Indium plays important roles in transparent conductors, the aerospace industry and flexible displays. Solid–liquid interdiffusion (SLID) bonding is one of the most reliable 3D integration technologies. The microstructure of the Cu/In/Ni bonding interface was investigated in this study. A low temperature of 180 C was used for SLID bonding. Cu-In compounds, Cu11In9 and CuIn2, were formed after SLID bonding at 180 C and storing at room temperature. The reaction between Cu and In is fast, even at room temperature. The low-temperature CuIn2 phase is undoubtedly worth investigating for solder joints.

語言：en

ISSN：1573-482X; 0957-4522

期刊性質：國外

收錄於：SCI

通訊作者：Y. W. Wang

審稿制度：是

國別：NLD

出版型式：電子版,紙本